Yes Tek AOI Bench Top
First Article Inspection -The FA-Inspector is a scanner-based optical inspection system used to automate first article inspections and subsequent production inspection tasks without programming. The FA-Inspector has two primary modes of operation: Comparator Mode and AOI Mode. Both AOI and Comparator Modes generate comprehensive reports complete with error location marks, fault classifications including the full PCB image or XY layout for easy rework. Reports can be viewed, printed, saved or emailed to customers for rapid prototype review. Defect coverage includes, all SMT and PTH parts down to 01005, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences such as: labels and colour variations.

VIPplus or VIPx X-Ray Image Processor software
VIP Plus is a Windows™ based Enhanced Image Processing software that provides additional capabilities for BGA and void measurements, and analysis reporting. VIPx provides a rich Windows™ based toolbox for image enhancement, filtering and analysis of PCBs, components and mechanical parts. VIPx delivers analytical (pass/fail) reporting based on user defined inspection criteria.

Verifier HR Advanced X-Ray Inspection System (90KV)
The Verifier HR (FSX-090) is an affordable high-resolution and high-magnification x-ray system designed for virtually any quality inspection and defect detection application. Magnification: >715X Spot Size: 5 micron Resolution: >40 lp/mm Field-of-View: >40mm

Verifier HR Advanced X-Ray Inspection System (80KV)
The Verifier (FSX-080) is an entry-level fundamental solder quality verification and defect detection tool (QuickCheck™). Designed for fast and intuitive BGA/SMT solder quality inspection applications. Magnification: >110X Spot Size: 50 micron Resolution: >20 lp/mm Field-of-View: >70mm

Verifier HR Advanced X-Ray Inspection System (75KV)
The Verifier Plus (FSX-075) is a low-cost, general purpose solder quality verification and defect detection tool. Designed for fast and intuitive BGA/SMT solder quality inspection applications. Magnification: >220X Spot Size: 33 micron Resolution: >30 lp/mm Field-of-View: >70mm

Mini V Bench Top X-Ray Inspection System
The MiniV is an economical, multi-purpose bench top x-ray inspection tool; designed for fast 2-D solder quality inspection, component inspection and rework verification. 75kV, 33 micron Board Handling: up to 432W x 533Hmm Sample Door: 737W X 140Hmm Footprint: 940W x 737D x 813Hmm Magnification: variable to 50X Field-of-View: up to 50mm Safe: CE certified and exceeds all CDRH and FDA safety and radiation requirements. Quality Inspection Applications Solder quality and voiding inspection SMT/PTH, CSP, BGA, QFN and connectors Bare board mis-registration and drill offset Rework Verification Counterfeit Device Screening

Microscopes
No longer is manual vision adequate on densely packed PCB’s. DIMA supplies a range of microscope heads with magnification in two steps. As today’s electronic assemblies become more advanced and the demand for quality increases daily. Inspection for quality becomes an integral part of the production process.