Water Soluble Solder paste WSP 2006
INTERFLUX® WSP 2006 solder paste is an absolute halide free, water soluble solder paste for both lead bearing and lead free alloys. It has good tack and stencil life. Its wide process window and ease-of-use make it the first choice in water soluble solder paste. It leaves minimal and easy cleanable residue. Water Soluble Pin testable Good tack and stencil life Minimal and clear residue Easy water washable residue Technical specifications viscosity 850 000cPs metal content 85 - 88,5% powder class 2-3-4 and 5 alloys SnCu, SnAg and SAC Sn62, Sn63 and AT

No clean Solder paste DP5505
INTERFLUX® DP 5505 solder paste is a halide free solder paste for lead free alloys. It has long tack and stencil life. Its wide process window and ease-of-use make it the first choice in lead free solder paste. It leaves minimal and pin testable residue. No-clean Pin testable Long tack and stencil life Minimal and clear residue Easy cleanable residue Technical specifications viscosity 850 000cPs metal content 85 - 88,5% powder class 2-3-4 and 5 alloys SAC305, SAC387, SAC405