Electronics Standard Products: Pick & Place
- Automatic Dispensing 1 & 2K Materials
- Board Handling
- Carriers
- Conveyors, FiFo/ LiFo, Turn & Flip Units
- Cutting
- Line loading / Unloading
- Storage
- Chairs
- Cleaning PCB's
- Cleaning: Stencil, Screen & Frames
- Component Handling
- Dispensing heads 1 & 2K components
- Fume Extraction
- Furniture
- Inspection: X-ray and AOI
- Ionic Contamination Tester
- Manual Dispensing 1 & 2K Materials
- Marking & Traceability
- Pick & Place
- Process Aids Cleaning
- Process Optimalisation
- Repair PCB (SMD & THT)
- Selective Coating
- Soldering
- Wave
- Vapor Phase
- Solder Paste
- Process Aids Solderbath and Selective Tips
- Solder Wire
- Selective
- Reflow
- Soldering and Repair Flux
- Solderpaste Printing
- Used Equipment
- Vacuum Dispensing 1 & 2K Materials
Compact-sized fine-pitch component mounter SI-F209
High-Precision Mounting
Both the fixed-position and moving cameras contribute to achieving high-precision mounting. This enables the cellular mounter to easily respond to smaller PWBs and higher-density mounting requirements, such as handling BGA/CSP mounting with a finer grid pitch.
Supporting Wider Range of Parts
The cellular mounter can be used to process products ranging from microchip parts to large connectors. Despite its compact size, its feeder units are designed to accommodate up to 40 cassettes (front) and 80 trays (rear), making it possible for a single machine to mount high-density PWBs.
Pursuing Space-Saving Design and Operability
The cellular mounter is only 1.2 m wide, while supporting a PWB size as large as 460 mm × 360 mm. It offers the highest level of space efficiency.
- Placement tact time: 7,350CPH(0.49sec/movable camera)2,500CPH(1.4sec/fixed camera)
- Placement precision: ±0.06mm (chip)
- Component size: 2012-□32mm(movable camera/reflective imaging)/2012-□19mm(movable camera/transmissive imaging) 2012-□18mm (fixed camera/reflective imaging) □18-□43mm(fixed camera/reflective imaging,medium view range,batch) -φ150mm(fixed camera reflective, medium, large view range, division into 4)
- thickness:Max.25mm
- External dimentions: 1,220(W)mm x 1,700(D)mm x 1,524(H)mm
SI-G200 AA high-speed mounter
The high-performance mounter responds to various operational needs by allowing a flexible combination of its replaceable "high-speed head" and "multifunction head" so as to best match the production line.
SI-G200 High-speed head
- Placement tact time:0.08sec/2 heads/movable(45,000CPH)
- Placement precision:45μm(Cpk 1.0 or greater)
- Component size ranges:0402 up to a 12mm square(movable camera), 6mm to 25mm square(fixed camera)
- Component height:6mm
SI-G200 Multifunction head
- Placement tact time:0.16sec/2 heads(22,500CPH)
- Placement precision:50μm(Cpk 1.0 or greater)(individual recognition), 60μm(Cpk 1.0 or greater)(collective recognition)
- Component size ranges:1005 chip to 100mm x 50mm
SI-F130AI Higher Speed Mounter
Additionally, the use of fully closed servo control ensures the highest level of precision.
Equipped with rotary head "Planet head".
New mechanism that drastically extends the maintenance intervals. High rigidity is also achieved by this new mechanism. In addition, newly optimized sequence guarantees a high level of accuracy.
Photo reflective/transmission part recognition
The Planet Head offers not only reflective part recognition, but transmission part recognition as well. These two recognition modes enable a cellular mounter to handle a wider range of parts, assuring you the capability to accommodate more diverse part sizes and high-density mounting.
- Placement tact time:25,000CPH
- Placement precision:50μm(Cpk 1.0 or greater)
- Component size ranges:0402(chip) up to a 12mm square(movable camera), 6mm to 25mm square(fixed camera/option)
- Component height:6mm
- Dimension:1,220(W)mm x 1,400(D)mm x 1,434(H)mm