Electronics Standard Products: Soldering

IF flux pen

  • Ideal for local flux application
  • Easy to use
  • Environmental friendly
  • Economical
  • Availible: refillable and non refillable
  • Made of ESD safe material
  • Soft brush tip or felt tip

Repair Flux IF 6000

Technical specifications

  • state                          viscous
  • color                           amber
  • j-std-004a class.        RO/ L0
  • halide content            0%
  • density                       0.870g/ml 

Seho GoWave

  • The GoWave is a powerful soldering system for those just entering into mass-soldering operations. This system is suited to a variety of applications ranging from entry-level mass-soldering to soldering in small or medium-sized batches. It also provides an economical soldering solution for universities, schools and laboratories.
  • The GoWave is especially featured with its innovative nozzle concept which is ideally suited for nearly all soldering tasks.
  • A special feature of this machine is its compact, but performance oriented design. Offering a fluxer module, an efficient preheater, innovative soldering area and microprocessor control, the GoWave presents the finest soldering technology in its class.
  • The redesigned GoWave features a longer reflection tunnel to promote better energy transfer to the board.
  • A new spray fluxer with HVLP technology controls quantity and spray pattern of the flux and helps to reduce flux consumption.
  • A new control unit with touch screen and USB interface completes the new concept.

Repair Flux IF 8001

Technical specifications

  • state                        liquid
  • color                         light yellow  
  • j-std-004a class.      RE/ L0
  • halide content          0% 
  • density                    0.8525g/ml  

Seho PowerWave

  • With the wave soldering system PowerWave, SEHO consequently realized a machine concept which offers a remarkable performance at simultaneously low investment costs. Complex SMD boards are as reliably soldered as conventional assemblies - due to up-to-date solder nozzle geometries and a flexible preheat area.
  • The modular construction of SEHO PowerWave offers the ideal concept for all production requirements and allows the machine to be integrated into existing fully automated production lines.
  • Performance reserves for the user have been created with the high performance pre-heating. SEHO PowerWave is available with either 1200 mm preheat length or 1800 mm. Depending on your production requirements, SEHO PowerWave may be equipped with a chain/finger conveyor system or with a solder frame conveyor for the processing of pallets.
  • The heart of the machine, the soldering area, is designed with a degree of flexibility that may perform all realistic soldering operations. Modern and innovative solder nozzle geometries provide ideal soldering results.

De-oxisidising gel IF 920 Tip activator for Selective Soldering Tips

Technical specifications

  • colour                     white/ yellow
  • viscosity                 280.000 cPs
  • specific density      1.00 - 1.20 g/ml 

Seho MaxiWave 2300-C

  • SEHO MaxiWave 2300 C is an up-to-date full tunnel nitrogen wave soldering system which is featured with low investment and operation costs. Simultaneously the machine ensures perfect soldering results due to its innovative soldering area.
  • The unique design of SEHO’s full-tunnel systems provides a stable, low-oxygen soldering atmosphere without complicated mechanical parts. Through gas jets located in the soldering area, nitrogen enters and flows through the tunnel. This flow displaces the oxygen from the process chamber. The advantage of SEHO’s technology is confirmed by minimal nitrogen consumption and a low residual oxygen concentration which is achieved within shortest time.
  • The MaxiWave 2300 C is featured with an integrated spray fluxing unit which is provided with an exhaust to avoid spray vapours within the process area.
  • The preheating area consists of 6 heating zones with a total length of 1800 mm. As the standard, the MaxiWave 2300 C is equipped with IR preheaters, however, quartz emitters or convection modules also may be integrated to meet special production requirements. Modern and innovative solder nozzle geometries in the flexible soldering area provide ideal soldering results.
  • Depending on production requirements the MaxiWave 2300 C either may be equipped with a flexible chain and finger conveyor or with a transport system for processing of solder frames.

Anti oxidant pellets Lead free

Technical specifications

  • alloy                     Sn100 (pure tin)
  • melting point        232°C 

Seho MWS2300

  • The MWS 2300: perfect in every detail. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the modular design of the system, makes the nitrogen wave soldering system MWS 2300 a powerful piece of equipment. It is ideally suited to solder demanding printed circuit boards – even at high throughputs.
  • The flexible preheating zone configuration with a preheat length between 1800 mm (70.8 inch) and 3300 mm (129.9 inch) makes it possible to suit your specific production requirements. Should your requirements change in the years to come, simply – and without great expense – change the configuration of the soldering machine.
  • The fluxing unit may be integrated in the machine or used as an external module – according to requirement.
  • Several factors ensure a clean process area and consequently the lowest possible maintenance costs: As a standard the MWS 2300 is equipped with filters at the inlet and unloading end, collecting the condensates. Beyond this, the machine may be optionally equipped with a controlled and integrated exhaust 4-stage filtering system.
  • Special highlight is the integrated temperature-controlled convection cooling module. It cools the assemblies already below liquidus before they are leaving the machine. This is of advantage – particularly at high temperature applications as for example in leadfree soldering processes.
  • Additionally, MWS 2300 features an intelligent solder channel suspension. It compensates for any changes due to thermal conditions, because the process relevant distance between solder wave and assembly remains always the same. Thus, it ensures perfect soldering results.

Anti oxidant pellets (lead containing)

Technical specifications

  • alloy SnPb
  • melting point 183 °C 

Lead free Solder wire Flexsol 903

Technical specifications

  • flux type IF 903
  • flux content 2,2% or 3,5%
  • j-std-004a class. RO/ L0
  • halide content 0,00%  
  • wire diameters (mm) 0,5 - 0,7 - 1,0 - 1,5 - 2,0

De-oxidation oil IF 910

Technical specifications

  • density          0,890g/ml @ 20°C
  • viscosity        100cSt @ 40°C

Lead containing Solder wire IF14-14

Available standard alloys are:

  • Sn60Pb40
  • Sn63Pb37
  • Sn62Pb36Ag2

 

Technical specifications

  • flux type IF 14
  • flux content 1,4%
  • j-std-004a class. RE/ L0  
  • halide content 0%
  • wire diameters (mm) 0,35 - 0,5 - 0,7 - 1,0 - 1,5

Vapor Phase Soldering Machine VS-500

Concept:

  • Compact
  • Versatile
  • Powerful off-line System 
  • Soldering complex SMT boards up to 500 x 500 mm

 

Every PCB will be soldered with the highest achievable quality due to:

  • The inert atmosphere created from the used medium
  • Incomparable rT across the board
  • No operator errors possible

Lead containing Solder wire IF14-10

Available standard alloys are:

  • Sn60Pb40
  • Sn63Pb37
  • Sn62Pb36Ag2

 

Technical specifications

  • flux type IF 14
  • flux content 1,0%
  • j-std-004a class. RE/ L0
  • halide content 0%
  • wire diameters (mm) 0,35 - 0,5 - 0,7 - 1,0 - 1,5

Pillarhouse Jade MKII

  • Adjustable tooling carrier holds PCB’s up to 457mm x 508mm
  • Drop-jet fluxer dual control fluxing system
  • Inert soldering atmosphere
  • Solder wave height measurement system
  • Manual fiducial correction available
  • Lead free compatible

Options

  • PillarPAD® offline programming system - Q4
  • Fiducial correction system
  • Automatic solder wire feed and level detect system
  • Selective Pre-heat
  • Solder wave height measurement system
  • Lead free solder pot assembly

Lead containing Solder wire IF14-09

Available standard alloys are:

  • Sn60Pb40
  • Sn63Pb37
  • Sn62Pb36Ag2

 

Technical specifications

  • flux type IF 14
  • flux content 0,9%
  • j-std-004a class. RE/ L0
  • halide content 0%
  • wire diameters (mm) 0,35 - 0,5 - 0,7 - 1,0 - 1,5

Seho GoSelectiveLight and SelectiveLine

Featuring:

  • A high-precision miniwave process
  • A precise axis system for exact positioning
  • Capable to handle both bare boards or assemblies in carriers up to 500 x 500 mm
  • Fiducial recognition function for automatic PCB alignment
  • Process visualization
  • Offline teach program
  • Drop jet fluxer
  • Top and bottom heating

 

The GoSelectiveLight

  • Stand alone
  • One basic Module contains all functions

 

The SelectiveLine:

  • Inline or stand alone
  • Upgraded individually to reduce cycle times remarkably if production volumes increase
  • Three basic modules:

 

          - the SelectiveLine soldering module
          - a separate fluxing module 
          - a preheat module. 

Lead containing Solder wire IF14-06

Available standard alloys are:

  • Sn60Pb40
  • Sn63Pb37
  • Sn62Pb36Ag2

 

Technical specifications

  • flux type IF 14
  • flux content 0,6%
  • j-std-004a class. RE/ L0
  • halide content 0%
  • wire diameters (mm) 0,35 - 0,5 - 0,7 - 1,0 - 1,5

Pillarhouse Jade Handex

  • Rotary indexing table with twin adjustable work holding positions
  • 457mm * 610mm Maximum PCB handeling size
  • Dro jet fluxer
  • Programmable flux bottle pressure
  • Pump RPM monitoring (option)
  • O²ppm monitoring (option)
  • Inert soldering atmosphere
  • Topside IR pre heat
  • Solder wave height measurement en correction (option)
  • Automatic fiducial recognition and correction system
  • Self diagnosing control system
  • On screen PCB navigation using Jpeg or Gerber
  • Mass flow meter to set en log flows (option)
  • Leadfree compatible

Seho GoReflow 1.8 and 2.3

  • Convection heating
  • Heating zone length of 1850 or 2350 mm
  • 5 Respectively 7 heating zones provide maximum flexibility in temperature profiling
  • The systems are designed for soldering in ambient atmosphere. 
  • Different conveyor concepts available:

 

          - a belt conveyor
          - a chain conveyor with or without center
             board support 
          - a combination of belt and chain 
             conveyor.

Pillarhouse Orissa 300

  • 305mm * 305mm PCB handeling (406mm * 305mm availible)
  • Inline or stand alone operation
  • No tooling required
  • Inline fluxer and pre heater availible
  • Fiducial correction (option)
  • Lead free compatible

Seho PowerReflow

  • Convection heating
  • Heating zone length of 2550
  • 6 Heating zones provide maximum flexibility in temperature profiling
  • Single blower technology for the heat transport
  • The systems are designed for soldering in ambient or N2 atmosphere
  • Flux managements system
  • LowMassConveyor (thermally invisible)
  • Different conveyor concepts available:

 

          - a belt conveyor
          - a chain conveyor with or without center
             board support 
          - a combination of belt and chain 
             conveyor.

Pillarhouse Orissa 600

  • 610mm * 610mm PCB handeling
  • Inline or stand alone operation
  • No tooling required
  • Inline fluxer an pre heater available
  • Fiducial correction (option)
  • Quick change Solder Bath
  • Top side pre heat while soldering

Seho MaxiReflow 3.0 and 3.6

  • Convection heating
  • Heating zone length of 3100 or 3700mm 
  • 7,8,10 or 12 Heating zones provide maximum flexibility in temperature profiling
  • Single blower technology for the heat transport
  • The systems are designed for soldering in ambient or N2 atmosphere
  • Flux managements system
  • LowMassConveyor (thermally invisible)
  • Different conveyor concepts available:

 

          - a belt conveyor
          - a chain conveyor with or without center
             board support
          - a combination of belt and chain 
             conveyor.

Pillarhouse Synchrodex

  • 457mm * 610mm Maximum PCB handeling size
  • Dro jet fluxer
  • Programmable flux bottle pressure
  • Pump RPM monitoring (option)
  • O²ppm monitoring (option)
  • Inert soldering atmosphere
  • Topside IR pre heat
  • Solder wave height measurement en correction (option)
  • Automatic fiducial recognition and correction system
  • Self diagnosing control system
  • On screen PCB navigation using Jpeg or Gerber
  • Mass flow meter to set en log flows (option)
  • Leadfree compatible

Interflux - Flux IF2005M - Alcohol based No-Residue™

Technical specifications

  • appareance           clear, colorless liquid
  • density at 20°       0.808g/ml 
  • solid content         1,8 %
  • j-std-004A class.   OR/ L0
  • acid number          14 - 16 mg KOH/g

 

 

Seho PowerSelective

  • Modular design for highest flexibility.
  • Inline or batch configuration
  • Both, bare boards as well as assemblies in carriers may be processed
  • A highly precise double portal axis system with servo drives (a positioning accuracy of ± 0.1 mm)
  • The gripper unit with a pneumatic rotating function up to 270° and can be tilted up to 12°
  • Posibility of installing two solderpots
  • Possible soldertechnology:

 

          - MiniWave
          - DipSoldering
          - WaveSoldering

Interflux - Flux IF2005K - Alcohol based No-Residue™ for Pb-free Soldering

Technical specifications

  • appareance           clear, colorless liquid
  • density at 20°       0.808g/ml 
  • solid content         2,5 %
  • j-std-004A class.   OR/ L0
  • acid number          18 - 22 mg KOH/g

 

 

Soldering Table-Top Robot TR300 with Iron Head

  • Work area: 300mm x 300mm
  • Operating system: WINDOWS XP Embedded
  • Cartesian robot with 3 or 4 axes (option: axe T)
  • Shift of axes: point-to-point
  • Reproduction of positioning: ±20µm
  • Open architecture for the integration of a large number of options

Interflux - Flux IF2005C - Alcohol based No-Residue™ for Selective Soldering

Technical specifications

  • Appareance           clear, colorless liquid
  • Density at 20°       0.814g/ml 
  • Solid content         3,4 %
  • j-std-004A class.   OR/ L0
  • Acid number          26 - 30 mg KOH/g

Soldering Robotic Cell FRC500 with iron head

  • The soldering robotic cell FRC500 as stand-alone version with iron head
  • PC controlled cell
  • Automation of selective point to point soldering 
  • Reasonable cost 
  • Designed for semi-automatic and fully automatic soldering operations from above
  • Work area: 500mm x 500mm
  • Operating system: WINDOWS XP
  • Cartesian robot with 3 or 4 axes (option: axis T)
  • X, Y and Z axes in closed loop
  • Shift of axes: point-to-point
  • Reproduction of positioning: ±20µm
  • Open architecture for the integration of many options

Interflux - T2005M - Flux thinner

Technical specifications

  • appareance           colourless  
  • density at 20°       0.800 - 0.803 g/ml
  • pH                         5 

Soldering Table-Top Robot TR300 with Micro-Flame head

  • Work area: 300mm x 300mm
  • Operating system: WINDOWS XP Embedded
  • Cartesian robot with 3 or 4 axes (option: axe T)
  • Shift of axes: point-to-point
  • Reproduction of positioning: ±20µm
  • Open architecture for the integration of a large number of options

Interflux - PacIFic 2009M - VOC free flux No-Clean

Technical specifications

  • appareance           clear, colorless liquid
  • density at 20°       1.00g/ml
  • solid content          3,7 %
  • j-std-004A class.   OR/ L0
  • acid number          24 mg KOH/g

Soldering Robotic Cell RC500 with Micro-Flame Head

  • Stand-alone version
  • With micro-flame head 
  • PC controlled cell
  • Allowing the automation of selective point to point soldering
  • There is no contact between the micro-flame head and the parts
  • Designed for semi-automatic and fully automatic soldering
  • Work area: 500mm x 500mm
  • Operating system: WINDOWS XP
  • Cartesian robot with 3 or 4 axes (option: axis T)
  • X, Y and Z axes in closed loop
  • Shift of axes: point-to-point
  • Reproduction of positioning: ±20µm
  • Open architecture for the integration of many options

Interflux - PacIFic 2009MLF - VOC free flux No-Clean

Technical specifications

  • appareance           transparent liquid  
  • density at 20°       1.00g/ml 
  • solid content          3,7 %
  • j-std-004A class.   OR/ L0
  • acid number           24 mg KOH/g 

No clean Solder Paste DP5505

Technical specifications

  • viscosity 850 000cPs
  • metal content 85 - 88,5%  
  • powder class 2-3-4 and 5
  • alloys SAC305, SAC387, SAC405

Interflux - Flux IF3006 - Low VOC Azeotrope flux

Technical specifications

  • appareance           clear, colorless liquid
  • density at 20°       0.872g/ml
  • solid content         3,2 %
  • j-std-004A class.   OR/ L0
  • acid number          >24 mg KOH/g

 

 

Water Soluble Solder Paste WSP 2006

Technical specifications

  • viscosity           850 000cPs
  • metal content   85 - 88,5%
  • powder class    2-3-4 and 5  
  • alloys                SnCu, SnAg and SAC
  •                          Sn62, Sn63 and AT 

BGA gel flux IF8300 series

Technical specifications

  • state                     viscous
  • j-std-004a class.   RE/ L0  
  • odour                    mildly sweet odour
  • ph                         3 
  • viscosity                210.000cPs (IF 8300)
  •                              70.000cPs (IF 8300-4)
  •                              25.000cPs (IF 8300-6)