INTERFLUX® IF 2005C has been developed for lead free selective soldering. It is the preferred flux of many for selective soldering processes. It is based on the highly successful IF 2005M and like the latter, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems, caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements and is QPL-listed.

Technical specifications

• appareance           clear, colorless liquid
• density at 20°       0.814g/ml 
• solid content         3,4 %
• j-std-004A class.   OR/ L0
• acid number          26 - 30 mg KOH/g