INTERFLUX® IF 2005K is a low solids no-clean flux designed for use in Pb-free wave soldering processes. In which, when compared to classic SnPb wave soldering, the temperatures and contact times might be higher and a soldering flux would need a longer process life time or activation span. Based on the IF 2005M, IF 2005K has all the advantages but with added process life time. With no rosin or resin to create a sticky residue, there are no contact problems caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements.

Technical specifications

• appareance           clear, colorless liquid
• density at 20°       0.808g/ml 
• solid content         2,5 %
• j-std-004A class.   OR/ L0
• acid number          18 - 22 mg KOH/g