INTERFLUX® IF 2005M is a low solids no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements and is QPL-listed. It provides great solderability on HAL, NiAU and OSP-coated PCB's.

Technical specifications

• appareance           clear, colorless liquid
• density at 20°       0.808g/ml 
• solid content         1,8 %
• j-std-004A class.   OR/ L0
• acid number          14 - 16 mg KOH/g